• k8凯发(中国)天生赢家·一触即发

    Press Releases

    Press Releases

    Data

    Title

    13 Jan 2014

    "SMIC Liver Transplant Program for Children" Helps 18 Kids

    22 Jan 2014

    Dual-interface Financial IC Card Chip Based on SMIC's eEEPROM Platform Gains CC EAL4+ Certification

    26 Jan 2014

    SMIC Unveils 28nm Readiness and MPW Milestone

    27 Jan 2014

    SMIC Announces Fourth Quarter 2013 Webcast Conference Call

    09 Feb 2014

    ARM and SMIC Broaden IP Partnership with 28nm Process for Mobile and Consumer Applications

    17 Feb 2014

    SMIC Reports 2013 Fourth Quarter Results

    20 Feb 2014

    SMIC and JCET Establish a Joint Venture to Build China's Local IC Manufacturing Supply Chain

    18 Mar 2014

    SMIC Attends SEMICON China 2014, Dr. Tzu-Yin Chiu Receives Outstanding EHS Achievement Award

    19 Mar 2014

    CEVA, SMIC and Brite Semiconductor Partner to Provide Hard Macro Versions of CEVA DSP Cores and Platforms

    24 Mar 2014

    SMIC Awarded Mirror Post "Outstanding Corporate Social Responsibility Award"

    25 Mar 2014

    SMIC Offers a Full Set of ESD Protection Service to Enhance the Whole chip ESD design for Customers

    14 Apr 2014

    SMIC Announces First Quarter 2014 Webcast Conference Call

    15 Apr 2014

    SMIC Appoints Hiroshi Ogawa as General Manager of SMIC Japan

    24 Apr 2014

    SMIC Kicks Off 6th Technology Workshop in Shanghai

    28 Apr 2014

    SMIC Reports 2014 First Quarter Results

    16 May 2014

    SMIC Forms RD Consortium with Universities, Research Academy, and Industrial Partners to Speed Up Advance Technology Development

    20 May 2014

    SMIC Offers Stable and Robust Wafer Productions for Fingerprint Sensors

    29 May 2014

    SMIC Donates an Additional 2 Million Yuan to its Children's Liver Transplant Program

    29 May 2014

    SMIC will Host its First Showcase in Design Automation Conference

    04 Jun 2014

    SMIC Announces Potential Non-exempt Connected Transactions: Potential Exercise Of Pre-emptive Rights By Datang And Country Hill

    05 Jun 2014

    SMIC Announces Placing of Existing Shares and Subscription of New Shares, Proposed Issue of US$95 Million Zero Coupon Convertible Bonds Due 2018, and Pre-emptive Rights of Datang and Country Hill

    05 Jun 2014

    SMIC and Brite Creates New Network Platform SMIC-ASIC.com

    24 Jun 2014

    SMIC Establishes the First 12 inch CIS Supply Chain in China

    03 Jul 2014

    SMIC and Qualcomm Collaborate on 28nm Wafer Production in China

    14 Jul 2014

    SMIC Announces Second Quarter 2014 Webcast Conference Call

    21 Jul 2014

    SMIC Revises Up Second Quarter 2014 Gross Margin Guidance

    04 Aug 2014

    HED Launches the First 55nm Smart Card Chip Based on SMIC's 55nm LL eFlash Platform

    06 Aug 2014

    SMIC Reports 2014 Second Quarter Results

    08 Aug 2014

    SMIC and JCET Establish a Joint Venture in Jiangyin National High-Tech Industrial Development Zone

    28 Aug 2014

    SMIC Announces Unaudited 2014 Interim Results

    28 Aug 2014

    SMIC selected in "Mainland Enterprises Listed in Hong Kong Ranking Award"

    10 Sep 2014

    SMIC Introduces Independently Developed 38nm NAND Process Technology

    18 Sep 2014

    2014 SMIC Technology Symposium Will Kick Off in Shanghai

    26 Sep 2014

    SMIC Announces Proposed Issue of US$500 Million 4.125% Bonds Due 2019

    29 Sep 2014

    SMIC Gives 2014 “Best IP Partner Award” of the Year

    21 Oct 2014

    SMIC Announces Third Quarter 2014 Webcast Conference Call

    23 Oct 2014

    SMIC and Maxscend Collaborate on 55nm RF IP Platform

    27 Oct 2014

    SMIC and ASML sign a Volume Purchase Agreement worth 450 million Euros

    05 Nov 2014

    SMIC Reports 2014 Third Quarter Results

    16 Dec 2014

    SMIC's Shenzhen Fab Goes into Operation - The first 8-inch wafer production line in Southern China

    18 Dec 2014

    SMIC Successfully Produces Qualcomm Snapdragon 410 processor in 28nm Process

    22 Dec 2014

    SMIC Announces Co-investment Agreement and Investment Exit Agreement in Relation to Proposed Acquisition

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