Press Releases
SMIC 28nm HKMG Process Ready to Launch Smartphone SoC with Leadcore
SHANGHAI, Feb. 16, 2016 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC", NYSE: SMI; SEHK: 981), and Leadcore Technology Co. Ltd. ("Leadcore"), one of the core members of Datang Telecom Technology and Industry Group, jointly announce that SMIC's 28nm HKMG (High-K Metal Gate) process is ready with customer's NTO (New Tape Out) success. Based on this platform, Leadcore is launching a 28nm SoC (System on a Chip) for smartphones and other fields of applications, including high-performance application processor and mobile baseband functions. The chip has passed validation and is ready for mass production.
SMIC is the first foundry to provide both 28nm PolySiON and 28nm HKMG processes in Mainland China. Compared with the traditional PolySiON process, SMIC's 28nm HKMG process can provide improved drive capability and transistor performance and substantially reduce gate leakage. Based on SMIC's 28nm HKMG process platform, the Smartphone SoC launched by Leadcore has better performance, higher speed and lower power consumption, and CPU performance achieves 1.6GHz. To extend Leadcore's success in 4G mobile communication market, this launch will expand the market share of Smartphones which are equipped with chips made in China.
"We're glad to collaborate with Leadcore on 28nm HKMG process and develop advanced Smartphone SoC. Following the successful adoption by mainstream smartphones of the chips based on SMIC's 28nm PolySiON process, our 28nm HKMG process has also been highly recognized by end customers and is ready for commercial use," said Dr. Tzu-Yin Chiu, Chief Executive Officer and Executive Director of SMIC, "We will continue to develop and improve 28nm derivative technology platforms and expect to introduce an enhanced compact version of 28nm HKMG process at the end of 2016, and provide more optimized processes to customers."
Qian Guoliang, General Manager of Leadcore said, "Leadcore is dedicated to the R&D and application of the core technologies of 3G/4G mobile connectivity terminal and collaboration with ecosystem partners to create world-class products. This powerful industrial alliance with SMIC will promote domestic chip technology development and help Leadcore to improve the cost performance of our products to better serve the markets of Smartphone, smart car and robot and support 'Made in China 2025.' In the future, we will further strengthen our cooperation with SMIC and develop high-performance chip products based on more advanced technology nodes."
About SMIC
Semiconductor Manufacturing International Corporation ("SMIC") (NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China. SMIC provides integrated circuit (IC) foundry and technology services at 0.35-micron to 28-nanometer. Headquartered in Shanghai, China, SMIC has a 300mm wafer fabrication facility (fab) and a 200mm mega-fab in Shanghai; a 300mm mega-fab and a second majority owned 300mm fab under development for advance nodes in Beijing; and 200mm fabs in Tianjin and Shenzhen. SMIC also has marketing and customer service offices in the U.S., Europe, Japan, and Taiwan, and a representative office in Hong Kong. For more information, please visit www.3dsentson.com.
Safe Harbor Statements
(Under the Private Securities Litigation Reform Act of 1995)
This document contains, in addition to historical information, "forward-looking statements" within the meaning of the "safe harbor" provisions of the U.S. Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on SMIC's current assumptions, expectations and projections about future events. SMIC uses words like "believe," "anticipate," "intend," "estimate," "expect," "project" and similar expressions to identify forward looking statements, although not all forward-looking statements contain these words. These forward-looking statements are necessarily estimates reflecting the best judgment of SMIC's senior management and involve significant risks, both known and unknown, uncertainties and other factors that may cause SMIC's actual performance, financial condition or results of operations to be materially different from those suggested by the forward-looking statements including, among others, risks associated with cyclicality and market conditions in the semiconductor industry, intense competition, timely wafer acceptance by SMIC's customers, timely introduction of new technologies, SMIC's ability to ramp new products into volume, supply and demand for semiconductor foundry services, industry overcapacity, shortages in equipment, components and raw materials, availability of manufacturing capacity, financial stability in end markets and intensive intellectual property litigation in high tech industry.
In addition to the information contained in this document, you should also consider the information contained in our other filings with the SEC, including our annual report on Form 20-F filed with the SEC on April 28, 2015, especially in the "Risk Factors" section and such other documents that we may file with the SEC or SEHK from time to time, including on Form 6-K. Other unknown or unpredictable factors also could have material adverse effects on our future results, performance or achievements. In light of these risks, uncertainties, assumptions and factors, the forward-looking events discussed in this document may not occur. You are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date stated or, if no date is stated, as of the date of this document.
SMIC Contact Information:
English Media
Michael Cheung
Tel: +86-21-3861-0000 x16812
Email: Michael_Cheung@3dsentson.com
Chinese Media
Jane Tang
Tel: +86-21-3861-0000 x10088
Email: Jane_Tang@3dsentson.com
About Leadcore
As a member of Datang Telecom Technology Co., Ltd. ("DTT"), Leadcore Technology Co., Ltd. (LEADCORE) is dedicated to providing leading 3G/4G chip and mobile terminal solutions. With more than 1000 employees, Leadcore's headquarters are located in Shanghai, China, and its RD and service centers covers in Beijing, Shenzhen and Hong Kong. LEADCORE has always been adhering to independent innovation. Carrying on the positive results Datang Telecom Technology & Industry Group has achieved in terms of core technologies and patents in the fields of 3G and 4G, it has dedicated itself to the development and application of core technologies for 2G, 3G and 4G mobile terminals over the past 10-plus years. With an eye to smart phones, smart cars, smart homes and IOT, it has been continuously promoting the development of LTE and LTE-A terminal technologies through technological innovation. Its range of products encompasses various consumer electronics including smart phones, tablet PCs, data type terminals, wearable devices and vehicle-mounted OBD.
Leadcore Contact Information:
Crystal Gao
Tel: +86-21-3127-1000 x7603
Email: gaobingying@leadcoretech.com
Photo - http://photos.prnasia.com/prnh/20160216/0861601247
