- Home
- Foundry Solutions
- Design Service
- Investor Relations
- Press Center
-
Career
- Career
- Social Recruitment
- Campus Recruitment
- Training and Development
- Life and Welfare
- Corporate Social Responsibility
- About SMIC
Press Releases
SMIC Expands Its One-Stop Offerings Through Wafer Bumping Services
Shanghai, China [2005-03-04]
(Shanghai, China. March 4, 2005) Semiconductor Manufacturing International Corporation (SMIC; NYSE: SMI and HKSE: 981) today announced that its wafer bumping line has successfully passed stringent quality and reliability verification and will soon enter volume production. This wafer bumping line completes SMIC's wafer manufacturing turnkey service offerings.
SMIC's wafer bumping line, which is located in the Class 1000 cleanroom of Fab 3, commenced equipment move-in in June 2004. Installation and testing were completed one month later and in October 2004, the first lot of wafers successfully passed reliability verification. Currently, SMIC's wafer bumping line has a capacity of 5,000 wafers per month and offers advanced wafer bumping services such as gold bump, solder bump, and single or multi-layer redistribution. The gold bump and solder bump lines have produced yields of over 98%. SMIC is also developing advanced wafer level chip scale packages as part of its comprehensive IC manufacturing solution.
"SMIC is developing one-stop turnkey services to meet its customers' needs. Currently, our bumping line offers gold bump, solder bump, and single or multi-layer redistribution services. These technologies can be applied to LCD drivers, SoCs, and other high-capability, high-speed, and high-density circuits," said Dr. Wayne Zheng, Director of Bumping Services. "By providing bumping services, SMIC can help customers elevate their yields and competitiveness."
SMIC is also working with its packaging partners to develop one-stop flip chip packaging turnkey services, which will include flip chip design, bumping manufacturing, and package and testing services.
About SMIC
SMIC (NYSE: SMI, SEHK: 0981.HK) is one of the leading semiconductor foundries in the world, providing integrated circuit (IC) manufacturing at 0.35-micron to 0.13-micron and finer line technologies to customers worldwide. Established in 2000, SMIC has four 8-inch wafer fabrication facilities in volume production in Shanghai and Tianjin. In addition, SMIC recently commenced pilot production at its 12-inch wafer fabrication facility in Beijing. SMIC maintains customer service and marketing offices in the U.S., Europe, and Japan. As part of its dedication towards providing high-quality services, SMIC strives to comply with or exceed international standards and has achieved ISO9001, ISO/TS16949, OHSAS18001, TL9000 and ISO14001 certifications. For more information, please visit http://www.3dsentson.com.
(Shanghai, China. March 4, 2005) Semiconductor Manufacturing International Corporation (SMIC; NYSE: SMI and HKSE: 981) today announced that its wafer bumping line has successfully passed stringent quality and reliability verification and will soon enter volume production. This wafer bumping line completes SMIC's wafer manufacturing turnkey service offerings.
SMIC's wafer bumping line, which is located in the Class 1000 cleanroom of Fab 3, commenced equipment move-in in June 2004. Installation and testing were completed one month later and in October 2004, the first lot of wafers successfully passed reliability verification. Currently, SMIC's wafer bumping line has a capacity of 5,000 wafers per month and offers advanced wafer bumping services such as gold bump, solder bump, and single or multi-layer redistribution. The gold bump and solder bump lines have produced yields of over 98%. SMIC is also developing advanced wafer level chip scale packages as part of its comprehensive IC manufacturing solution.
"SMIC is developing one-stop turnkey services to meet its customers' needs. Currently, our bumping line offers gold bump, solder bump, and single or multi-layer redistribution services. These technologies can be applied to LCD drivers, SoCs, and other high-capability, high-speed, and high-density circuits," said Dr. Wayne Zheng, Director of Bumping Services. "By providing bumping services, SMIC can help customers elevate their yields and competitiveness."
SMIC is also working with its packaging partners to develop one-stop flip chip packaging turnkey services, which will include flip chip design, bumping manufacturing, and package and testing services.
About SMIC
SMIC (NYSE: SMI, SEHK: 0981.HK) is one of the leading semiconductor foundries in the world, providing integrated circuit (IC) manufacturing at 0.35-micron to 0.13-micron and finer line technologies to customers worldwide. Established in 2000, SMIC has four 8-inch wafer fabrication facilities in volume production in Shanghai and Tianjin. In addition, SMIC recently commenced pilot production at its 12-inch wafer fabrication facility in Beijing. SMIC maintains customer service and marketing offices in the U.S., Europe, and Japan. As part of its dedication towards providing high-quality services, SMIC strives to comply with or exceed international standards and has achieved ISO9001, ISO/TS16949, OHSAS18001, TL9000 and ISO14001 certifications. For more information, please visit http://www.3dsentson.com.
